1～6 item / All 6 items
![Cross-edge microfabrication [silicon products]](https://image.mono.ipros.com/public/product/image/3b7/319551005/IPROS_13836726167087188000.jpg?w=280&h=280)
Material purity of 99.999999999% or higher! Impurity contamination management is implemented with dedicated silicon equipment.
We use a material with the same thermal expansion rate as silicon wafers to reduce slip occurrence on the wafers.
![Cross-edge microfabrication [Glass through-hole wiring board (TGV)]](https://image.mono.ipros.com/public/product/image/46a/319551009/IPROS_16689217629553020000.jpg?w=280&h=280)
Three-dimensional wafer-level packaging (WLP) is suitable for miniaturizing semiconductors. Through-silicon vias enable improvements in high-frequency characteristics.
This product features numerous electrically conductive metal via-holes formed within borosilicate glass substrates such as Pyrex and Tempax. It can accommodate substrates up to a maximum diameter of 8 inches. It has good flatness and airtightness, making it suitable for anodic bonding for sealing silicon-based devices. 【Features】 ○ Capable of anodic bonding with silicon wafers Solves outgassing issues by enabling anodic bonding without the use of adhesives. ○ Excellent high-frequency characteristics - Ensures low stray inductance and low electrical resistance of vias. - Achieves high insulation compared to silicon by using glass as the base material. ○ Designed to function as a heat sink - Allows the vias to serve as thermal vias by incorporating silicon. ○ Transmits visible light - Enables confirmation of bonding points and transmission of optical signals. ○ Compatible with wafers up to Φ200mm. *For more details, please download the catalog or contact us.
Combining multiple processes to develop innovative products! We propose solutions that match your needs.
"Cross-edge microfabrication" refers to a processing method that combines two or more different types of processing within the manufacturing of a single product. The five core processing techniques are "cutting, grinding, polishing, metallizing, and joining." At our company, we propose solutions that match our customers' needs by considering "quality, cost, and mass production" through composite processing technology that crosses these five advanced techniques. [Features] ■ Maintains stable quality ■ Achieves processing with short lead times ■ Provides cost-effective services ■ Solves customer challenges by developing innovative products through the combination of multiple processes *For more details, please refer to the PDF document or feel free to contact us.
![Cross-edge microfabrication [glass microfabrication]](https://image.mono.ipros.com/public/product/image/f97/319551004/IPROS_12284845090736490000.jpg?w=280&h=280)
Glass processing with excellent transparency, chemical resistance, and heat resistance.
Our company offers glass processing that excels in transparency, chemical resistance, and heat resistance. The glass we recommend includes high-transparency quartz glass, Tempax glass, and others. 【Features】 ◎ Ultra-thin polishing possible from 0.1 to 0.15 mm → Enables observation of previously unobservable cells, proteins, DNA, etc. ◎ Enables analyses and liquid delivery to microchannels that were previously impossible 【PDMS (silicone resin)】 ◎ Anodic bonding (adhesive-free) with Si (silicon) is possible 【Tempax glass】 → No concerns about adverse effects on cells, etc., caused by adhesives ◎ Capable of producing microchannel products with groove widths of 30 to 50 μm, high aspect ratio channel products (width 100 μm, depth 800 μm), and channel products with vias (which allow for electrical control through electrophoresis by embedding vias) 【Channel products】 ＼Please make use of the wonderful properties of glass in your bioanalysis and research／ *For more details, please contact us or download the catalog (PDF).
![Cross-edge microfabrication [Ultra-pressure-resistant compact water-cooled heat sink]](https://image.mono.ipros.com/public/product/image/2d5/319551007/IPROS_13329095839829273000.jpg?w=280&h=280)
Achieving a one-piece structure heat sink without joints.
This is an announcement from Technisco Co., Ltd. regarding the "Cross Edge Micro Machining [Ultra Pressure Resistant Compact Water-Cooled Heat Sink]."
![Cross-edge microfabrication [microchannel cooler]](https://image.mono.ipros.com/public/product/image/22e/319551008/IPROS_15135300974487607000.jpg?w=280&h=280)
Realization of high output and long lifespan for LD modules.
This is an announcement from Technisco Co., Ltd. regarding the "Cross Edge Micro Machining [Micro Channel Cooler]."
